TOB diamond grinding tablets (d series) is will featured of Micron, and Asia micron level diamond micro powder coated attached with high strength polyester film of a new precision grinding polishing material, applies of various ceramic (as oxidation zirconium, and alumina,), and Sapphire, and quartz (as fiber array column, and hard disk glass base board), and carbide (as head material AlTiC), and hot spray layer (as carbide tungsten, and carbide chrome), and semiconductor wafer, high hard material of precision grinding polishing.。
Product features
- Selection of abrasives, grinding evenly, has good polishing effects;
- Good adhesion and abrasion resistance, long service life;
- Model range, quality, stability, and small differences between batches;
- Water or oil as the grinding media for grinding and polishing, can also drygrinding and polishing
Commonly used models (fiber optic connector grind)
|
Size/μm |
Type |
Application |
Pressure （g/conn） |
Life Time
|
|
30 |
D30-LSA |
Remove Epoxy & Angle Cutting |
100-350 |
>10 |
|
15 |
D15-LSA |
Remove Epoxy & Angle Cutting |
100-350 |
>10 |
|
9 |
D9-LSA |
Middle Grinding |
100-300 |
>50 |
|
D9-LSX |
Middle Grinding |
100-300 |
>50 |
|
|
6 |
D6-LSA |
Middle Grinding |
100-300 |
>50 |
|
3 |
D3-LSA |
Fine Polishing |
100-300 |
>50 |
|
1 |
D1-LSA |
Fine Polishing |
150-300 |
>50 |
|
D1-LSX |
Fine Polishing |
100-200 |
>50 |
|
|
0.5 |
D0.5-LSA |
Fine Polishing |
150-300 |
>50 |
常用规格
|
Round |
Φ76mm、Φ110mm、Φ127mm（5inch）、Φ203mm（8inch） |
|
Square |
114mm×114mm、152mm×152mm（6inch）、228mm×228mm（9inch） |
In addition to the above standard types and sizes, other types and sizes can be customized according to customer need; back-pressure sensitive adhesive products can be.
- Optical communications industry in a variety of grinding and polishing of optical fiber connectors, optical fiber devices;
- Precision polishing of optical glass, Crystal, LCD substrate;
- Surface polishing heads, computer hard drives;
- Metallographical analysis of materials such as ceramics, glass grinding and polishing.
TOB金刚石研磨片（D系列）是将精选的微米、亚微米级金刚石微粉涂附于高强聚酯薄膜上的一种新型精密研磨抛光材料，适用于各种陶瓷（如氧化锆、氧化铝等）、蓝宝石、石英（如光纤阵列、硬盘玻璃基板）、硬质合金（如磁头材料AlTiC）、热喷涂层（如碳化钨、碳化铬）、半导体硅片等高硬材料的精密研磨抛光。
产品特性
◆ 精选磨料，研磨涂层均匀，具有良好的研磨抛光效果；
◆ 良好的附着力和耐磨性，使用寿命长；
◆ 型号齐全，质量稳定，批次之间差异小；
◆ 可以水或者油为研磨介质进行研磨抛光，也可直接干法研磨抛光
常用型号（光纤连接器研磨）
|
粒径/μm |
型号 |
作用 |
研磨压力（g/conn） |
寿命（盘） |
|
30 |
D30-LSA |
去胶，开斜面 |
100-350 |
>10 |
|
15 |
D15-LSA |
开斜面，粗磨 |
100-350 |
>10 |
|
9 |
D9-LSA |
中磨 |
100-300 |
>50 |
|
D9-LSX |
中磨 |
100-300 |
>50 |
|
|
6 |
D6-LSA |
中磨 |
100-300 |
>50 |
|
3 |
D3-LSA |
细磨 |
100-300 |
>50 |
|
1 |
D1-LSA |
细磨 |
150-300 |
>50 |
|
D1-LSX |
细磨 |
100-200 |
>50 |
|
|
0.5 |
D0.5-LSA |
细磨 |
150-300 |
>50 |
常用规格
|
圆形 |
Φ76mm、Φ110mm、Φ127mm（5inch）、Φ203mm（8inch） |
|
方型 |
114mm×114mm、152mm×152mm（6inch）、228mm×228mm（9inch） |
除了以上标准型号和尺寸外，其它型号和尺寸可根据客户需要定制；产品可以背压敏胶。
应用领域
◆ 光通讯行业中各种光纤连接器、光纤器件的研磨抛光；
◆ 光学玻璃、晶体、LCD基板的精密抛光；
◆ 磁头、电脑硬盘表面研磨抛光；
◆ 陶瓷、玻璃等材料金相分析中的研磨抛光。