
Silicon Oxide Polishing SLurry, named CMP polishing liquid (chemical mechanical polishing liquid), I company of silica polishing liquid Department “a step synthesis method” preparation, polishing glue grain compact, and uniform, and into spherical, has polishing efficiency high, and grain degrees distribution uniform, and impurities content low features, widely application with fiber devices, and wafer, and glass, and Crystal, and Sapphire, and mold, various precision devices of last polishing. Particle size, concentration, pH values can be designed according to customer needs.
- Spherical colloidal particle, compact structure, good quality of polishing,and polishing efficiency can be obtained.
- Particle size can be controlled, centralized distribution (± 10nm).
- High purity, low metal content.
- Particle size can be set according to user requirements, concentration, PHvalues, Ion, and so on.
Basic characteristics
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features |
Model and standard |
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SO-60D |
SO-100D |
SO-120D |
SO-140D |
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Particle size(nm) |
60-80 |
80-100 |
100-120 |
140-160 |
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SiO2 Content (by weight) |
40±1%(Recommendations before using diluted with water) |
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Na2O Content (by weight) |
≤0.4% |
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dispersion medium |
water |
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Color |
oyster white |
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decentralized state |
monodispersepolymer |
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PH |
2-11(acid2.5-3.5,alkaline9-10) |
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particle morphology |
Ball |
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Warranty(Month) |
≥12(0℃以上) |
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Areas of application

二氧化硅抛光液又称CMP抛光液(化学机械抛光液),我公司的二氧化硅抛光液系“一步合成法”制备,抛光胶粒致密、均匀、成球形,具有抛光效率高、粒度分布均匀、杂质含量低等特点,广泛应用于光纤器件、硅片、光学玻璃、晶体、蓝宝石、模具等各种精密器件的最后抛光。粒度、浓度、pH值可根据客户需要进行设计。
产品特点
- 球形胶粒,结构致密,可获得良好的抛光质量和抛光效率。
- 粒径可控,分布集中(±10nm)。
- 纯度高,金属离子含量低。
- 可根据用户要求设定粒径大小、浓度、PH值、离子含量等指标。
基本特性
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特性 |
型号及标准 |
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SO-60D |
SO-100D |
SO-120D |
SO-140D |
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粒径(nm) |
60-80 |
80-100 |
100-120 |
140-160 |
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SiO2含量(重量) |
10-50%(一般推荐用20%) |
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Na2O含量(重量) |
≤0.4% |
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分散介质 |
水 |
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外观 |
乳白色 |
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分散状态 |
单分散 |
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PH值 |
2-11(一般酸性2.5-3.5,碱性9-10) |
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胶粒形态 |
球型 |
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保质期(月) |
≥12(0℃以上) |
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应用领域
光纤连接器、半导体硅片、砷化镓片、蓝宝石、半导体化合物晶片、硬盘盘片液晶玻璃、光学镜头、精密模具表面等产品的抛光。
包装及储存
1.采用聚乙烯塑料桶包装,主要包装规格有500ml、5kg、25kg。
2.贮存时应避免曝晒,贮存温度为0-40℃。低于0℃则产生冻胶失效。
3.避免敞口长期与空气接触。